EQS-News: Chipmakers must improve the performance of their products - LPKF has the solution
Source: EQS
Chipmakers must improve the performance of their products - LPKF has the solution
Garbsen, Advanced packaging with glass substrates Today, Advanced Packaging is a strategically important discipline in chip manufacturing. It enables chip architects to connect highly integrated chips more tightly together. With glass substrates instead of organic or silicon substrates, even more chiplets can be packed into one system. The systems become faster, take up less space and consume less power. “The notion that glass is an ideal substrate material is not exactly new, but it used to be very difficult to process in a quality that these fields of application require,” says Roman Ostholt, Managing Director Electronics at LPKF and key developer of LIDE. “With LIDE, glass substrates from 100µm up to 1.1mm can be processed quickly, precisely, and without damage,” he adds. High process maturity of LIDE technology “Our technology has reached an excellent level of maturity and can meet the high requirements of the semiconductor industry”, says The high level of process maturity and the proof of operational performance have already convinced global players to work with LPKF’s technology. “Our customers appreciate the precision and flexibility we can offer, and they are particularly impressed by the new design possibilities which LIDE opens up for them”, says Ostholt. Industry experts assume that the transformation of the semiconductor industry to high volume manufacturing of glass-based packages will take place in the second half of this decade. LPKF is ready to drive this change forward with its outstanding know-how and equipment solutions. For more information please visit: https://lide.lpkf.com/de About LPKF LPKF Laser & Electronics SE is a leading provider of laser-based solutions for the technology industry. LPKF laser systems are of crucial importance to the production of printed circuit boards, microchips, automotive parts, solar modules and a large number of other components. Founded in 1976, the company is headquartered in Garbsen near Contact: Bettina Schäfer, Senior Manager Investor Relations & Corporate Communication Investorrelations@lpkf.com
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Language: | English |
Company: | LPKF Laser & Electronics SE |
Osteriede 7 | |
30827 Garbsen | |
Phone: | +49 (0) 5131 7095-0 |
Fax: | +49 (0) 5131 7095-95 |
E-mail: | investorrelations@lpkf.com |
Internet: | www.lpkf.com |
ISIN: | DE0006450000 |
WKN: | 645000 |
Listed: | Regulated Market in |
EQS News ID: | 1901291 |
End of News |
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1901291 13.05.2024 CET/CEST