Hewlett Packard Enterprise and Danfoss Partner to Curb Data Center Energy Consumption and Reuse Excess Heat
Enhanced modular data center accelerates AI and compute-intensive workloads at the edge with integrated heat capture systems for external reuse
The rapid integration of AI technologies across organizations and businesses is expected to have a dramatic increase in the power demand and utilization of AI optimized IT infrastructure. According to the
To address these issues, the new energy efficient data center solution from HPE and Danfoss offers:
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HPE’s scalable
Modular Data Center (MDC), in the form of small footprint, high-density (kW/rack) containers, can be deployed nearly anywhere in the total absence of heavy industry and incorporates technologies such as direct liquid cooling, reducing overall energy consumption by 20%. - Danfoss’ innovative solutions, including heat reuse modules that capture excess heat from data centers to provide renewable heating onsite and to neighboring buildings and industries for various applications, and Turbocor® oil-free compressors that enhance data center cooling efficiency by up to 30%.
“Our strategic partnership with HPE is a great example of how we revolutionize building and decarbonizing the data center industry together with customers,” said Jürgen Fischer, President, Danfoss Climate Solutions. “With this latest cross-industry partnership we’re building the blueprint for the next generation of sustainable datacenters – using technologies available today.”
Benefits and agility of modularity
HPE’s MDC incorporates direct liquid cooling (DLC) technologies to enhance energy efficiency by over 20% and optimize energy production and distribution, leading to notable energy savings. The design’s compactness minimizes energy loss by reducing the distance for energy and cooling fluid transport and maximizes the temperature differential at the inlet and outlet, which promotes the capture of waste heat. Furthermore, the MDC’s agility and the exclusion of heavy industrial materials negate the need for costly, conventional building materials and substantially reduces the time to market. Deployment can be achieved three times quicker than with traditional data centers, decreasing from 18 months to as few as 6 months. Finally, the reduced land footprint and flexibility of the MDCs allow for placement in proximity to data generation sites, which diminishes the energy impact and bottlenecks associated with complex networking solutions and data transfer, while also supporting enhanced data governance and security.
“At HPE, we believe in the power of collaboration to create transformative solutions,” said
With unparalleled density, HPE’s modular data centers offer an impressive power usage effectiveness (PUE) of 1.14 in contrast to the PUE of 1.3 to 1.4 typically associated with the best modern designs of traditional brick-and-mortar data centers. Capable of handling the most power-demanding architectures like HPE Cray Supercomputing EX4000, HPE’s modular data center is the adequate architecture for mission critical and compute-intensive workloads like supercomputing and generative AI, enabling scientists, universities, and enterprises to achieve faster outcomes.
From chip to chiller: driving innovation in decarbonization
To leverage excess heat – one of the largest untapped sources of energy and the largest potential for data centers across
HPE IT Sustainability Services – Data Center Heat Recovery is inspired by how Danfoss is already using heat reuse technology at its own headquarters campus in
The new scalable modular data center offering leverages Danfoss technologies, including Turbocor® compressors for heat pumps and chillers, heat exchangers, heat reuse modules, drives and pump skids allowing data centers to be cooled up to 30% more efficiently while recovering and reusing excess heat. It’s a modular solution with components that work together seamlessly and includes two technology stack options with a heat recovery system, including hydronic heat recovery heat exchanger and water-water heat pump, recovering heat from an air-cooled edge-to-cloud modular data center today and potentially second phase liquid cooled HPC modular data center.
As part of its holistic “Reduce, Reuse, Resource” approach, Danfoss also partners with HPE to retire its end-of-use IT assets through HPE Asset Upcycling Services, a circular economy solution that enables technology refurbishment and reuse, while recovering economic value from those assets.
Availability
HPE IT Sustainability Services – Data Center Heat Recovery is available to order immediately.
Additional Resources
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HPE and Danfoss unveil Heat Recovery Solution for Enterprise Environmental Goals by
Pascal Lecoq , Worldwide Director, Sustainable Data Center Modernization at HPE -
UK Government invests £225m to create UK’s most powerful AI supercomputer withUniversity of Bristol andHewlett Packard Enterprise -
Hewlett Packard Enterprise builds AI supercomputer for CRIANN to accelerate scientific research and innovation - Danfoss solutions for datacenters
- Danfoss paper on decarbonization of data center industry
About
About Danfoss
Danfoss engineers solutions that increase machine productivity, reduce emissions, lower energy consumption, and enable electrification. Our solutions are used in such areas as refrigeration, air conditioning, heating, power conversion, motor control, industrial machinery, automotive, marine, and off- and on-highway equipment. We also provide solutions for renewable energy, such as solar and wind power, as well as district-energy infrastructure for cities. Our innovative engineering dates back to 1933. Danfoss is family- and foundation-owned, employing more than 40,000 people, serving customers in more than 100 countries through a global footprint of 95 factories.
www.danfoss.com.
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1Electricity 2024 - Analysis and forecast to 2026 (iea.blob.core.windows.net)
2 Excess heat, also called surplus heat or waste heat, can be reused through existing and well-proven technologies, most notably heat pumps.
3Excess heat - Danfoss Impact Issue no. 2
4 When using Direct Liquid Cooling (DLC) technologies.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240618025437/en/
Media Contacts:
benjamin.lesueur@hpe.com
Pia Beltrao Hansen
pia.hansen@danfoss.com
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