Kulicke & Soffa Announces Sizeable Order for Advanced Ball Bonding
Recovering Capacity & New Technology Needs to Support General Semiconductor Market
The semiconductor industry continues to experience rapid digital transformation, driven by emerging technologies such as artificial intelligence, high-bandwidth connectivity, and Internet-of-Things (IoT) applications. These growing market opportunities depend on transformative semiconductor packaging solutions due to the well-known cost challenges of traditional node shrink. Kulicke & Soffa's growing portfolio of high-performance advanced interconnect solutions enables this next-level of semiconductor complexity by supporting higher package-level transistor density through finer interconnects, thereby enabling the growth of cost effective, high-volume 2.5D and 3D semiconductor packages.
RAPID™ Pro delivers leading industry performance and efficiency, meeting the most critical requirements of the high-volume Assembly and Test market, which is estimated to account for around two-thirds of the global demand for Ball Bonding applications. ProSuite provides additional value proposition by providing new response-based bonding and looping capabilities, ensuring competitive production of complex wire bonded packages. "We are pleased to observe both capacity and technology related demand return to this critical customer group. This sizeable order from a key Assembly and Test customer, combined with the demand for our ProSuite solutions, highlights the growing market demand for more robust and capable manufacturing solutions," said
During its recently completed second fiscal quarter of 2024, the Company's Ball Bonding segment revenue has grown by more than 50% over the same period in the prior fiscal year. K&S is preparing to ramp
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Kulicke & Soffa
Public Relations
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Kulicke & Soffa
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Finance
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investor@kns.com
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