Ansys, Intel Foundry Collaborate on Multiphysics Analysis Solution for EMIB 2.5D Assembly Technology
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Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel's embedded multi-die interconnect bridge (EMIB) assembly technology -
Ansys multiphysics analyses provide signoff verification of thermal integrity, power integrity, and mechanical reliability
Ansys RedHawk-SC Electrothermal™ is an electronic design automation (EDA) platform that enables multiphysics analysis of 2.5D and 3D-ICs with multiple dies. It can perform thermal analysis with anisotropic thermal conduction, which is essential for Intel's new backside power distribution technology. Thermal gradients also lead to mechanical stresses and warpage that can impact product reliability over time. Power integrity verification is done through chip/package co-simulation, which gives the 3D system-level context needed for maximum accuracy.
"Intel's enablement of Intel 18A and EMIB technology is a differentiated approach to multi-die assembly that has a number of significant advantages over traditional stacking techniques," said
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