Alpha and Omega Semiconductor Introduces Innovatively Designed, Space-Saving Half-Bridge MOSFET for DC-DC Applications
By reducing the footprint size to enable a more efficient high-power design, the AONG36322 XSPairFET™ provides a leading solution for space-constrained DC-DC Buck applications
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![The AONG36322 XSPairFET™ provides a leading solution for space-constrained DC-DC Buck applications (Photo: Business Wire)](https://mms.businesswire.com/media/20240523491137/en/2140295/4/AOS_36322.jpg)
The AONG36322 XSPairFET™ provides a leading solution for space-constrained DC-DC Buck applications (Photo: Business Wire)
The AONG36322 is an extension to the AOS XSPairFET lineup, designed with the latest bottom-source packaging technology. Its integrated high-side and low-side MOSFETs feature 4.5 mOhms and 1.3 mOhms maximum on-resistance, respectively, where the low-side MOSFET source is connected directly to the exposed pad on the PCB to enhance thermal dissipation. A definite advantage of the state-of-the-art AONG36322 package design is that it delivers lower parasitic inductance, significantly reducing switch node ringing.
“We designed the AONG36322 in the DFN3.5x5 package to help our customers meet their ongoing board space limitations. Our breakthrough AOS XSPairFET design also gives them the benefit of improved power density and efficiency to overcome the challenge developers face in meeting ever-increasing POL Buck application performance goals,” said
Technical Highlights
Part Number |
Package |
VDS (V) |
VGS (±V) |
RDS(ON) (mΩ max) at VGS= |
Ciss (pF) |
Coss (pF) |
Crss (pF) |
Qg (nC) |
||
10V |
4.5V |
|||||||||
DFN 3.5x5 |
High Side (Q1) |
30 |
20 |
4.5 |
8.0 |
1150 |
380 |
555 |
7.5 |
|
Low Side (Q2) |
30 |
12 |
1.3 |
1.75 |
4180 |
880 |
125 |
30 |
Pricing and Availability
The AONG36322 is immediately available in production quantities with a lead time of 16 weeks. The unit price in 1,000-piece quantities is
About AOS
Forward-Looking Statements
This press release contains forward-looking statements that are based on current expectations, estimates, forecasts, and projections of future performance based on management’s judgment, beliefs, current trends, and anticipated product performance. These forward-looking statements include, without limitation, references to the efficiency and capability of new products and the potential to expand into new markets. Forward-looking statements involve risks and uncertainties that may cause actual results to differ materially from those contained in the forward-looking statements. These factors include but are not limited to, the actual product performance in volume production, the quality and reliability of the product, our ability to achieve design wins, the general business and economic conditions, the state of the semiconductor industry, and other risks as described in the Company’s annual report and other filings with the
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