Intel Accelerates AI Everywhere at Computex 2024; Redefines Compute Power, Performance and Affordability with new Xeon 6, Gaudi Accelerators and Lunar Lake Architecture to Grow AI PC Leadership
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NEWS HIGHLIGHTS
- Launches Intel® Xeon® 6 processors with Efficient-cores (E-cores), delivering performance and power efficiency for high-density, scale-out workloads in the data center. Enables 3:1 rack consolidation, rack-level performance gains of up to 4.2x and performance per watt gains of up to 2.6x1.
- Announces pricing for Intel® Gaudi® 2 and Intel® Gaudi® 3 AI accelerator kits, delivering high performance with up to one-third lower cost compared to competitive platforms2. The combination of Xeon processors with Gaudi AI accelerators in a system offers a powerful solution for making AI faster, cheaper and more accessible.
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Unveils Lunar Lake client processor architecture to continue to grow the AI PC category. The next generation of AI PCs – with breakthrough x86 power efficiency and no-compromise application compatibility – will deliver up to 40% lower system-on-chip (SoC) power when compared with the previous generation3.
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At
“AI is driving one of the most consequential eras of innovation the industry has ever seen,” said
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Gelsinger continued, “Intel is one of the only companies in the world innovating across the full spectrum of the AI market opportunity – from semiconductor manufacturing to PC, network, edge and data center systems. Our latest Xeon, Gaudi and Core Ultra platforms, combined with the power of our hardware and software ecosystem, are delivering the flexible, secure, sustainable and cost-effective solutions our customers need to maximize the immense opportunities ahead.”
During his
Gelsinger and others made it clear that
With these developments,
Modernizing the
As digital transformations accelerate, companies face mounting pressures to refresh their aging data center systems to capture cost savings, achieve sustainability goals, maximize physical floor and rack space, and create brand-new digital capabilities across the enterprise.
The entire Xeon 6 platform and family of processors is purpose-built for addressing these challenges with both E-core (Efficient-core) and P-core (Performance-core) SKUs to address the broad array of use cases and workloads, from AI and other high-performance compute needs to scalable cloud-native applications. Both E-cores and P-cores are built on a compatible architecture with a shared software stack and an open ecosystem of hardware and software vendors.
The first of the Xeon 6 processors to debut is the
With high core density and exceptional performance per watt,
Additionally, Xeon 6 E-core has tremendous density advantages, enabling rack-level consolidation of 3-to-1, providing customers with a rack-level performance gain of up to 4.2x and performance per watt gain of up to 2.6x when compared with 2nd Gen Intel® Xeon® processors on media transcode workloads1. Using less power and rack space, Xeon 6 processors free up compute capacity and infrastructure for innovative new AI projects.
Fact Sheet:
Providing High Performance GenAI at Significantly Lower Total Cost with
Today, harnessing the power of generative AI becomes faster and less expensive. As the dominant infrastructure choice, x86 operates at scale in nearly all data center environments, serving as the foundation for integrating the power of AI while ensuring cost-effective interoperability and the tremendous benefits of an open ecosystem of developers and customers.
As the only MLPerf-benchmarked alternative to Nvidia H100 for training and inference of large language models (LLM), the Gaudi architecture gives customers the GenAI performance they seek with a price-performance advantage that provides choice and fast deployment time at lower total cost of operating.
A standard AI kit including eight
To make these AI systems broadly available,
Accelerating On-Device AI for laptop PCs; New Architecture Delivers 3x AI Compute and Incredible Power-Efficiency
Beyond the data center,
Today the AI PC category is transforming every aspect of the compute experience, and
AI PCs are projected to make up 80% of the PC market by 2028, according to
Quickly building on these unmatched advantages, the company today revealed the architectural details of
Lunar Lake’s all-new architecture will enable:
- New Performance-cores (P-cores) and Efficient-cores (E-cores) deliver significant performance and energy efficiency improvements.
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A fourth-generation
Intel neural processing unit (NPU) with up to 48 tera-operations per second (TOPS) of AI performance. This powerful NPU delivers up to 4x AI compute over the previous generation, enabling corresponding improvements in generative AI. - An all-new GPU design, code-named Battlemage, combines two new innovations: Xe2 GPU cores for graphics and Xe Matrix Extension (XMX) arrays for AI. The Xe2 GPU cores improve gaming and graphics performance by 1.5x over the previous generation, while the new XMX arrays enable a second AI accelerator with up to 67 TOPS of performance for extraordinary throughput in AI content creation.
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Advanced low-power island, a novel compute cluster and
Intel innovation that handles background and productivity tasks with extreme efficiency, enabling amazing laptop battery life.
As others prepare to enter the AI PC market,
Fact Sheet:
As
Forward-Looking Statements
This release contains forward-looking statements that involve a number of risks and uncertainties, including with respect to Intel’s product roadmap and anticipated product sales and competitiveness and projected growth and trends in markets relevant to Intel’s business. Such statements involve many risks and uncertainties that could cause our actual results to differ materially from those expressed or implied, including those associated with:
- the high level of competition and rapid technological change in our industry;
- the significant long-term and inherently risky investments we are making in R&D and manufacturing facilities that may not realize a favorable return;
- the complexities and uncertainties in developing and implementing new semiconductor products and manufacturing process technologies;
- our ability to time and scale our capital investments appropriately and successfully secure favorable alternative financing arrangements and government grants;
- implementing new business strategies and investing in new businesses and technologies;
- changes in demand for our products;
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macroeconomic conditions and geopolitical tensions and conflicts, including geopolitical and trade tensions between the US and
China , the impacts ofRussia's war onUkraine , tensions and conflict affectingIsrael and theMiddle East , and rising tensions between mainlandChina andTaiwan ; - the evolving market for products with AI capabilities;
- our complex global supply chain, including from disruptions, delays, trade tensions and conflicts, or shortages;
- product defects, errata and other product issues, particularly as we develop next-generation products and implement next-generation manufacturing process technologies;
- potential security vulnerabilities in our products;
- increasing and evolving cybersecurity threats and privacy risks;
- IP risks including related litigation and regulatory proceedings;
- the need to attract, retain, and motivate key talent;
- strategic transactions and investments;
- sales-related risks, including customer concentration and the use of distributors and other third parties;
- our significantly reduced return of capital in recent years;
- our debt obligations and our ability to access sources of capital;
- complex and evolving laws and regulations across many jurisdictions;
- fluctuations in currency exchange rates;
- changes in our effective tax rate;
- catastrophic events;
- environmental, health, safety, and product regulations;
- our initiatives and new legal requirements with respect to corporate responsibility matters; and
-
other risks and uncertainties described in this release, our 2023 Form 10-K, and our other filings with the
SEC .
Given these risks and uncertainties, readers are cautioned not to place undue reliance on such forward-looking statements. Readers are urged to carefully review and consider the various disclosures made in this release and in other documents we file from time to time with the
Unless specifically indicated otherwise, the forward-looking statements in this release are based on management's expectations as of the date of this release, unless an earlier date is specified, including expectations based on third-party information and projections that management believes to be reputable. We do not undertake, and expressly disclaim any duty, to update such statements, whether as a result of new information, new developments, or otherwise, except to the extent that disclosure may be required by law.
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1 See [7T1] at intel.com/processorclaims: Intel® Xeon® 6. Results may vary.
2 Pricing estimates based on publicly available information and
3 Disclaimer for footnote: Power measurements are based on
4 Pricing guidance for cards and systems is for modeling purposes only. Please consult your original equipment manufacturer (OEM) of choice for final pricing. Results may vary based upon volumes and lead times.
5 Source for Nvidia H100 GPT 3 performance: https://mlcommons.org/benchmarks/training/, v3.1, closed division round. Accessed
6 Source for Nvidia H100 LLAMA2-70B performance https://developer.nvidia.com/deep-learning-performance-training-inference/training,
7 Source for Nvidia performance: Overview — tensorrt_llm documentation (nvidia.github.io), May, 2024. Reported numbers are per GPU.
8 Based on total number of platform Tops on
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