Axcelis Announces Participation in SEMICON India 2024
Showcase Features the Purion and GSD Ovation Series of Ion Implanters Designed to Deliver Significant Technology and Manufacturing Advantages
Attendees are invited to visit the
- Purion Power Series™ - Featuring Axcelis' innovative solution for thin silicon, TAIKO and silicon carbide (SiC) wafer processing across the full power device applications space.
- Purion H™ Series - Including the new Purion H5™ and the Purion Dragon™, both designed to provide a comprehensive solution for high current implants.
-
Purion H200
™ -
Axcelis' state of the art single wafer high current medium energy implanter designed to address the unique implant needs for devices designed for the Internet of Things (IoT) and power applications. - Purion XE™ Series - Including the new Purion XEmax™, is the industry leading high energy implant platform, featuring patented Boost Technology™, designed for the most advanced image sensor applications up to 15MeV.
- Purion M™ Series - Offering the broadest spectrum of mid-current doses available, enabling unparalleled flexibility to meet today's evolving implant requirements.
- GSD Ovation™ - Providing the most cost-effective way to extend high current and high energy batch platform capability by supporting emerging applications in power markets, as well as wafer splitting (Si and SiC) and alternate substrates (lithium tantalate and ceramic).
President and CEO of Axcelis Technologies
About
CONTACTS:
Press/Media Relations Contacts:
Senior Director,
Telephone: (978) 787-4266
Email: Maureen.Hart@axcelis.com
Investor Relations Contact:
Senior Vice President, Investor Relations and Corporate Strategy
Telephone: (978) 787-2352
Email: David.Ryzhik@axcelis.com
View original content to download multimedia:https://www.prnewswire.com/news-releases/axcelis-announces-participation-in-semicon-india-2024-302233281.html
SOURCE