DNP to Open First Overseas R&D Center in the Netherlands
Will promote Co-Packaged Optics R&D
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Aerial view of HTCE (Copyright: High Tech Campus Eindhoven)
HTCE is one of the leading innovation hubs in
As an initial project, DNP will promote R&D into Co-Packaged Optics, which integrates optical communication technology with electronic technology to achieve a high information processing performance. Co-Packaged Optics is attracting attention as a next-generation semiconductor technology.
In
[R&D Contents and Goals]
- Co-Packaged Optics technology exhibits a high information processing performance, low power consumption, and energy savings, and is expected to be deployed in next-generation semiconductors.
- In order to accelerate the development of package components for Co-Packaged Optics, DNP will conduct three years of joint research with PITC, and other HTCE-based organizations. The goal is to acquire cutting-edge technologies, such as precision patterning technology for optical materials related to Co-Packaged Optics, as well as to develop new partnerships.
[Looking Ahead]
Through the new R&D base in
About DNP
DNP was established in 1876, and has become a leading global company that leverages print-based solutions to engineer fresh business opportunities while protecting the environment and creating a more vibrant world for all. We capitalize on core competencies in microfabrication and precision coating technology to provide products for the display, electronic device, and optical film markets. We have also developed new products, such as vapor chamber and reflect array that offer next-generation communication solutions for more people-friendly information society.
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Media contact
DNP:
kitagawa-y3@mail.dnp.co.jp
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