LitePoint Accelerates Wi-Fi 8 Innovation with Qualcomm Technologies Through Advanced Testing
Comprehensive design validation and performance testing on Qualcomm® Wi-Fi 8 technology achieved on the LitePoint IQxel-MX wireless test platform.
Wi-Fi 8 will enable immersive experiences, intelligent network management, and unprecedented efficiency, addressing the growing demands of AI-driven workloads, IoT proliferation, and next-generation cloud services. Wi‑Fi 8 introduces a new generation of PHY innovations designed to unlock greater performance, efficiency, and reliability. These advancements enable dependable and consistent connectivity, setting the stage for ultra‑high reliability and next‑level user experiences.
LitePoint’s IQxel-MX platform is enabling
- Advanced Error Correction: Stronger LDPC coding for fewer dropped packets and more reliable connections.
- Smarter MIMO Modulation: Adaptive modulation per stream for higher throughput and resilience.
- Optimized Rate Adaptation: Finer MCS levels for smoother performance in changing conditions.
- Extended Range: ELR improves connectivity for low-power and distant devices.
- Improved Spectrum Efficiency: DRU boosts uplink power and coverage within PSD limits.
These innovations align with Qualcomm Technologies’ vision for Wi-Fi 8 which focuses on creating connected ecosystems that leverage AI-driven optimizations, seamless multi-AP coordination, and advanced spectrum management. These innovations aim to deliver ultra-low latency, higher capacity, and smarter connectivity. This foundation will power the next wave of applications—from immersive AR/VR and intelligent IoT to mission-critical enterprise and connected home experiences.
“Wi-Fi 8 will redefine connectivity with smarter, more efficient networks that leverage AI and advanced coordination. Our long-term collaboration with
Technical Details:
The IQxel-MX is uniquely positioned to address the complexities of Wi-Fi 8 (UHR), Wi-Fi 7 (EHT) and legacy Wi-Fi testing. The platform offers comprehensive, full lifecycle physical layer testing capabilities, from early-stage R&D characterization to high-volume manufacturing.
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