Company Announcements

TOKYO--(BUSINESS WIRE)--Feb. 19, 2026-- FUJIFILM Corporation will present the company’s latest research findings at SPIE Advanced Lithography + Patterning 2026 (SPIE 2026), taking place February 22-26, 2026, in San Jose, California. The international conference is organized by SPIE, the international society for optics and photonics.

As part of its growth strategy aiming to double revenue in the semiconductor materials business to 500 billion yen (3.26B $USD) by FY2030 compared with FY2024, Fujifilm is focusing on the fast‑growing advanced resist market—particularly for AI semiconductors—with the goal of expanding its market share.

At SPIE 2026, researchers from FUJIFILM Corporation will highlight progress in Extreme Ultraviolet (EUV)^*1 resisttechnologies,nanoimprint lithography (NIL)^*2resists and PFAS‑free^*3 resists. These cutting‑edge technologies contribute to further miniaturization and performance improvement in semiconductor manufacturing and form a key pillar supporting Fujifilm’s materials business.

“As a leading supplier of electronic materials to the global semiconductor industry, including AI semiconductors, the advanced resist market provides a unique opportunity for our company and our One-Stop Solution philosophy for customers. Our SPIE presentations will provide attendees with a greater understanding of our capabilities in this area,” says Tetsuya Iwasaki, director, senior vice president, and general manager of Electronic Materials Business Division, FUJIFILM Corporation, Japan. “The conference is an opportunity to further highlight our industry-leading technology and Research & Development that helps drive semiconductor innovations.”

Specifically, researchers from FUJIFILM Corporation will report on enhanced defect‑reduction performance in negative‑tone EUV resists and progress in developing next‑generation photoresists compatible with high‑NA EUV exposure. These developments support high‑precision patterning required for state‑of‑the‑art semiconductor manufacturing at ever‑smaller dimensions. Progress in positive‑tone EUV resist development will also be shared, expanding the lineup to meet diverse customer needs. Additionally, Fujifilm will introduce new developments in UV-curable spin-coating NIL resists and its PFAS-free positive tone ArF^*4 immersion resist lineup, which addresses rising demand for alternative materials in line with the company’s global Sustainable Value Plan 2030.

Fujifilm Presentation Topics at SPIE 2026

• Feb. 23, 2:30 p.m.: Development of EUV CAR-NTD process with new organic solvent based-developer for scaling (View abstract, presenter & authors)
• Feb 24, 2:50 p.m.: Development of spin-coating UV-NIL resist for semiconductor device manufacturing (View abstract, presenter & authors)
• Feb 25, 4:00 p.m.: Challenges and progress of PFAS alternatives for ArF resist (View abstract, presenter & authors)
• Feb 25, 5:30 p.m.: Novel EUV photoresists for positive tone development (View abstract, presenter & authors)

About Fujifilm’s Semiconductor Materials Business

Fujifilm operates manufacturing facilities in Asia, Europe, and the United States and offers semiconductor materials used in wafer processing to post processing in semiconductor manufacturing including photoresists, photolithography-related materials^*5, CMP slurries^*6, post-CMP cleaners^*7, thin-film chemicals^*8, polyimides^*9 and high-purity process chemicals^*10, as well as WAVE CONTROL MOSAIC™^*11 which includes color filter materials for image sensors. In addition to its extensive product lineup covering almost the entire range of semiconductor manufacturing processes, from leading-edge to legacy semiconductors, the company is committed to solving customers' issues and contributing to the development of the semiconductor industry by providing one-stop solutions that leverage its global supply structure and advanced R&D capabilities. For more information, please visit: https://www.fujifilm.com/em-global/en.

About Fujifilm

FUJIFILM Holdings Corporation, headquartered in Tokyo, leverages its depth of knowledge and proprietary core technologies to deliver innovative products and services across the globe through the four key business segments of healthcare, electronics, business innovation, and imaging with over 70,000 employees. Guided and united by our Group Purpose of “giving our world more smiles,” we address social challenges and create a positive impact on society through our products, services, and business operations. Under its medium-term management plan, VISION2030, which ends in FY2030, we aspire to continue our evolution into a company that creates value and smiles for various stakeholders as a collection of global leading businesses and achieve a global revenue of 4 trillion yen (29 billion USD at an exchange rate of 140 JPY/USD). For more information, please visit: www.fujifilmholdings.com.

For further details about our commitment to sustainability and Fujifilm’s Sustainable Value Plan 2030, click here.

FUJIFILM and WAVE CONTROL MOSAIC are registered trademarks of FUJIFILM Corporation and its affiliates.

^*1 Advanced lithography technology using extreme ultraviolet (EUV) light, necessary for generations with features finer than 10 nanometers.
^*2 Nanoimprint lithography. A technology in which a mask (mold) with circuit patterns is pressed onto the resist applied to a semiconductor wafer, like a stamp, to transfer and form the circuit patterns.
^*3 PFAS refers to a collective term for perfluoroalkyl compounds, polyfluoroalkyl compounds, and their salts, as defined in the OECD's 2021 report “Reconciling Terminology of the Universe of Per- and Polyfluoroalkyl Substances: Recommendations and Practical Guidance.” Accordingly, the claim ‘PFAS-Free’ denotes the absence of substances falling within this defined group.
^*4 An exposure method using ArF (argon fluoride) excimer laser light (wavelength 193 nm), which is currently the most widely used advanced lithography technology.
^*5 Development solutions, cleaners and other materials used in the photolithography process of semiconductor manufacturing.
^*6 A proprietary formulation containing an abrasive that uniformly planarizes semiconductor surface, which contains a mixture of wires and insulation films of varying hardness.
^*7 Cleaners used after polishing with CMP slurry to remove particles, minute metal fragments and organic residues while protecting the metal surface.
^*8 Materials for forming low-dielectric insulation films.
^*9 A material with strong heat resistance and insulation properties, used for forming semiconductors’ protective films and rewiring layers.
^*10 High-purity chemicals used in the cleaning and drying processes. The chemicals are employed to remove contaminants during the cleaning and drying stages of semiconductor manufacturing, as well as to eliminate metals and oils during the etching process.
^*11 General term referring to a group of functional materials for controlling electromagnetic light waves in a broad range of wavelengths, including photosensitive color materials for manufacturing color filters for image sensors such as CMOS sensors, used in digital cameras and smartphones.

© 2026 FUJIFILM North America Corporation and its affiliates. All rights reserved.

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Onsite Contact:　　
FUJIFILM Electronic Materials U.S.A., Inc.
Christopher Smalley, Senior Strategist, Marketing & Communications
E-mail: Christopher.smalley@fujifilm.com

Media Contact:
FUJIFILM Holdings America Corp.
Robert Wallace, Sr. Mgr., Corporate Communications
E-mail: Robert.wallace@fujifilm.com

Source: FUJIFILM Corporation