Onto Innovation Launches Dragonfly® G5 Inspection System
Leading high bandwidth memory (HBM) manufacturer completes evaluation and selects Dragonfly G5 for 2D inspection for HBM4 ramp
Commitments for double-digit orders of both Dragonfly G5 and 3Di™ technology received, with shipments starting in the second quarter of 2026
Dragonfly G5 and 3Di technology strengthen Onto’s position in advanced packaging which is expected to demonstrate greater than 30% growth in 2026
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A leading manufacturer of HBM selected the Dragonfly G5 system and related 3Di technology after recently concluding extensive onsite competitive evaluations of each. In this assessment, the Dragonfly G5 system delivered significant advantages in both resolution and throughput across several applications critical to HBM4 yield. The successful evaluations resulted in order commitments for double-digit numbers of Dragonfly G5 systems to support the majority of their 2D inspection needs and a similar number of orders for 3Di technology, displacing the previously established tool of record. Shipments of both the Dragonfly G5 systems and 3Di technology are expected to commence in the second quarter.
“We are proud to announce this new inspection solution which is exceeding expectations in performance and value to our customers,” said
New features of the Dragonfly G5 system include:
- A new optical system supporting multiple techniques such as brightfield and darkfield, delivering defect sensitivity down to 150nm at throughputs up to five times faster than the previous generation Dragonfly technology.
- A new and proprietary higher power multi‑mode illumination technology offered specifically for applications where current technologies struggle to separate sub-micron critical defects from surface variation in applications such as CMP and hybrid bonding.
- A portfolio of powerful new machine learning algorithms including flexible die‑to‑die detection which delivers enhanced detection sensitivity while significantly reducing recipe setup time which is a key advantage for customers with a large number of inspection steps.
- The new platform will continue to support all additional proprietary sensors such as Clearfind® technology, sub-surface defect inspection, and 3D metrology, providing customers the most flexible and powerful solution for a wide range of current and future process control needs.
To learn more about the Dragonfly G5 inspection and metrology system, contact us or reach out to your local sales team.
About
Our breadth of offerings across the entire semiconductor value chain combined with our connected thinking approach results in a unique perspective to help solve our customers’ most difficult yield, device performance, quality, and reliability issues.
Additional information can be found at www.ontoinnovation.com.
Forward Looking Statements
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include statements relating to Onto Innovation’s business momentum and future growth; technology development, product introduction and acceptance of Onto Innovation’s products and services; capabilities of Onto Innovation’s products and customer service and their benefits to customers; Onto Innovation’s manufacturing practices and ability to both deliver products and services consistent with our customers’ demands and expectations and strengthen its market position, Onto Innovation’s expectations regarding the semiconductor market outlook as well as other matters that are not purely historical data.
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ONTO-IP
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Investor Relations:
sidney.ho@ontoinnovation.com
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