Carrier Ventures Expands Investment in ZutaCore to Scale Liquid Cooling for AI Data Centers
Investment strengthens Carrier's liquid cooling capabilities and enhances its QuantumLeap™ suite for thermal and integrated management solutions
The move strengthens a strategic partnership to support high-density AI data centers and advances Carrier's strategy to deliver integrated solutions across the data center thermal lifecycle. It expands its capabilities in advanced liquid cooling technologies, including interoperable single and two-phase cooling systems. These capabilities further enhance Carrier's broader QuantumLeap™ suite of thermal and integrated management solutions.
"AI is fundamentally reshaping data center architecture, with thermal management emerging as a key constraint to scale," said
The follow-on investment builds on Carrier's 2025 investment in ZutaCore and comes as AI-driven chip power densities continue to rise, increasing demand for advanced cooling solutions, including liquid cooling.
"Our expanded partnership with Carrier reflects the need for new approaches to data center cooling," said Erez Freibach, Chairman and CEO, ZutaCore. "By combining ZutaCore's waterless, direct-to-chip technology with Carrier's system-level expertise, we are enabling the next generation of high-density AI data centers."
ZutaCore is a
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