Intel Announces New AI Innovations at Computex — Chip to Rackscale AI Solutions Delivered to Customers with the Help of Strategic Industry Partners
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New rackscale AI infrastructure:
Intel announced rackscale AI infrastructure for customers interested in scaling their inference and agentic workloads based on Intel® Xeon® processors and SambaNova SN-50 Reconfigurable Dataflow Units (RDUs). -
Agentic Cloud Offering for Disaggregated Inference: Vector Core Compute, a new purpose-built enterprise inference cloud formed by
Vista Equity Partners andCambium Capital , unveiled fully disaggregated inference running onIntel Xeon processors, SambaNova RDUs, and NVIDIA Blackwell GPUs. -
Deep industry solutions: Strategic collaborations with industry leaders, including Foxconn, Siemens, Hitachi, Echo Neurotechnologies, and Greenstone Biosciences focused on delivering integrated vertical customer solutions based on
Intel processors and purpose-built silicon. -
Intel Xeon 6+ processors: Next-generation data center CPU built onIntel 18A and designed for high-density, scale-out workloads. - PC, gaming handheld, and physical AI momentum: Broad partner support and customer uptake for the Series 3 family of processors.
“For more than five decades,
Rackscale AI Infrastructure for Inference and Agentic Workloads
As the training of AI models has matured, and more AI applications have moved into production, the industry has witnessed an exponential rise in the demand for cost-effective and power-efficient AI inference. With the emergence of agentic AI, the growing demand for AI inference is changing the balance of power in the data center, returning the CPU to a position of prominence.
According to Creative Strategies CEO and principal analyst
Seeking to capitalize on this trend at a systems level,
The companies are demonstrating production-ready racks that combine
Agentic Cloud Offering for Fully Disaggregated Inference
Vector Core Compute, a new purpose-built enterprise inference cloud formed by
Together.ai is the first commercial customer running workloads on Vector Core Compute’s agentic cloud, which delivered the fastest enterprise inference on the MiniMax 2.5 model of any architecture to date.
Industry Specific Solutions Based on
It is often stated that AI is transforming every industry. It is also true that the computing needs of specific industries vary widely due to differences in their business environments, processes, workflows, and customers.
Today,
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Foxconn: The world’s largest electronics manufacturer is working with
Intel to provide systems integration capabilities for rackscale AI infrastructure and explore collaboration in design services and custom silicon development. -
Siemens: The leading technology company focused on industry, infrastructure, transport, and healthcare and
Intel have expanded their existing collaboration. In 2023, Siemens andIntel first joined forces; now the two companies are strengthening their collaboration across the entire value chain from design to manufacturing to chips embedded in Siemens products. Siemens brings its capabilities for the design, manufacturing, and lifecycle management of chips, as well as fab digitalization, automation, and electrification. This collaboration will enable the exploration of use cases for purpose-builtIntel silicon for Siemens’ varied compute requirements, which may include edge devices, high-performance computing (HPC), and robotics. -
Hitachi: A global leader in digital innovation and sustainable solutions and
Intel intend to work together on a range of solutions including foundry tools and quantum computing. -
Echo Neurotechnologies: The developer of neuroscience and brain-computer interface solutions and
Intel are exploring new neuromorphic technologies to advance neuro-AI, speech neuroscience, brain-computer interfaces, andIntel 's future neuromorphic and conventional hardware architectures. -
Greenstone Biosciences:
The Silicon Valley biotech company plans to useIntel processors, purpose-built silicon, and theIntel Health and Life Sciences AI Suite to accelerate human-centric drug development using stem cells, organoids, genomics, and AI.
Extending this week’s announcements from data centers and racks down to chip-level innovations,
Built on
Xeon 6+ can be configured for AI rackscale infrastructure purpose-built for hosting agents at maximum density. For example, a single liquid-cooled rack can deliver 36,864 cores using 32U of compute space, which provides the highest agent density available (at approximately 100-kilowatt rack power compute).
Optimized for environments where watts per rack, throughput per core, and latency predictability are critical, Xeon 6+ emphasizes scale-out performance—making room for new AI workloads without requiring disruptive data center redesign.
Series 3 Scale and Momentum
Core Ultra Series 3, built on
Beyond the PC,
About Intel
Intel (Nasdaq: INTC) designs and manufactures advanced semiconductors that connect and power the modern world. Every day, our engineers create new technologies that enhance and shape the future of computing to enable new possibilities for every customer we serve. Learn more at intel.com.
Vector Core Compute cloud inference performance testing by Artificial Analysis. For details visit Artificial Analysis. Results may vary.
Performance varies by use, configuration, and other factors. Learn more on the Performance Index site. Intel does not control or audit third-party data. You should consult other sources to evaluate accuracy.
Intel technologies may require enabled hardware, software, or service activation. No product or component can be absolutely secure. Your costs and results may vary.
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