Lintes Accelerates AI Connectivity Expansion Through Optical Communication and Scalable Manufacturing
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Driven by growing AI demand,
Lintes (TWSE: 6715) reported 17.2% YoY Q1 revenue growth and showcased its AI connectivity solutions atCOMPUTEX 2026. -
Lintes has expanded its R&D since 2025 to fully commit to next-generation products driven by AI demand, including 6.4T CPC and CPO Socket (32TX+ 32RX). -
Through its strategic investment in Gen Precision,
Lintes leverages Gen Precision's 0.1 μm precision machining and automation expertise to build highly replicable production and inspection lines for passive optical components, supporting global capacity expansion.
"Many people recognize
At
- Hyperscale AI networking solutions, including AEC, DAC, CPC, and CPO solutions developed for cluster infrastructure.
- High-density AI server interconnect solutions, including MCIO, Multi-Trak, and SlimSAS solutions designed for scale-up computing environments.
- High-bandwidth connectivity for edge and device AI applications, including Thunderbolt and USB solutions.
To fulfill the global large-scale mass production demand,
Meanwhile, leveraging Gen Precision's expertise in automated production line construction, automated optical coupling and testing, and smart manufacturing system integration, this collaboration will accelerate
About Lintes Technology
Lintes Technology is a leading provider of high-speed interconnect solutions, delivering advanced cables, connectors, and optical modules for data-intensive applications. With deep expertise in signal integrity and system integration, Lintes enables scalable AI connectivity from edge devices to hyperscale data centers supporting reliable, high-bandwidth communication across next-generation infrastructure.
Learn more at lintestech.com or follow us on LinkedIn.
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SOURCE Lintes Technology