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About the company
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
- Revenue in USD (TTM)710.00m
- Net income in USD61.47m
- Incorporated1997
- Employees5.55k
- LocationChipMOS Technologies IncNo. 1, R&D Road 1, Hsinchu Science ParkBAOSHAN 308TaiwanTWN
- Phone+886 35770055
- Fax+886 35668981
- Websitehttps://www.chipmos.com/