Semtech Showcases AI Interconnect Leadership with Live 1.6T Demos at OFC 2026
Live demonstrations to highlight high-speed optical and copper interconnect and next-generation PON solutions
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According to Dell’Oro Group, 2026 will mark the first year of volume deployments of 1.6 Tbps switches, with the ramp expected to be even faster than 800 Gbps — surpassing 5 million ports within one to two years of shipments. The firm also projects strong double-digit growth in AI networking spending in 2026, driven by ongoing scale-out of AI clusters.
“The companies defining AI infrastructure are integrating across the signal chain — not assembling it from fragmented point solutions,” said
Demonstrations at OFC 2026
- High-Speed Copper Interconnect for AI Scale-Up: Semtech will demonstrate ultra-low-power, low-latency 1.6T active copper cables (ACCs) using its GN8234 redriver ICs running live traffic to NVIDIA 224G/lane SerDes. Additionally, Semtech will demonstrate 3.2T ACCs at 448G per channel using its next-generation GN8304 redriver, designed to address increased data throughput requirements over copper links.
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Multi-Vendor 1.6T Optical Interconnect for Data Center and AI Scale-Out:
- Demo 1: NVIDIA’s latest-generation 1.6T DR8 OSFP transceiver powered by Semtech’s GN1834D transimpedance amplifier (TIA) and GN187N1 modulator driver, running live traffic in an NVIDIA test platform.
- Demo 2: A 224G/lane 102.4T Ethernet switch running live traffic over both single-mode and multimode fiber. The system uses multi-vendor 1.6T optical OSFP transceivers — including fully retimed optics (FRO), linear retimed optics (LRO) and linear pluggable optics (LPO) — built on Semtech’s GN1832, GN1834D, GN1834L, and GN1836 TIAs and GN1887 and GN1878 modulator drivers.
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Indium Phosphide (InP)
Laser and Gain Chip Technology: Semtech will showcase its high-performance, high-output-power C-band gain chip for tunable laser applications in coherent optical modules. -
Next-Generation 448G/Lane Physical Medium Dependent (PMD) ICs: Semtech will demonstrate its TN622 modulator driver and TN14740 TIA at 448G/lane, highlighting advances designed to address the growing bandwidth demands of AI workloads. - Passive Optical Networking (PON): A live demonstration will feature the GN7153C optical line terminal (OLT) Combo IC paired with the GN28L46 Burst Mode TIA for next-generation XGS-PON networks.
Technical Presentation at OFC 2026
“200G LPO: Design Challenges and Latest Test Data”
Visit Semtech at OFC 2026
Customers and partners are invited to visit Semtech at booth #1812 during OFC 2026,
Semtech will also participate in the OFC Career Fair,
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